KUALA LUMPUR, Sept 17 (Bernama) -- Arteris Inc, a provider of semiconductor technology for artificial intelligence (AI) applications, has expanded its multi-die portfolio to help semiconductor companies transition from monolithic system-on-chip (SoC) designs to chiplet-based architectures for AI, high-performance computing (HPC) and consumer electronics.
The company said its new FlexGen Multi-Die product extends network-on-chip (NoC) connectivity and data movement across die-to-die links, allowing multiple dies to operate as a unified architecture without requiring engineering teams to redesign how data moves through the system.
Arteris president and chief executive officer, K Charles Janac said multi-die architectures are becoming increasingly important as semiconductor systems expand beyond the boundaries of a single die.
According to the company in a statement, the new FlexGen Multi-Die product is designed for non-coherent AI and HPC architectures and complements Ncore Multi-Die, which supports cache-coherent systems.
FlexGen Multi-Die supports bidirectional transactions over a single Universal Chiplet Interconnect Express (UCIe) physical layer (PHY), reducing PHY area, power and input/output requirements by up to 50 per cent, the company said.
It also supports virtual channel link technology to improve utilisation of chiplet input/output resources and quality-of-service mechanisms to maintain throughput for high-priority traffic across shared die-to-die links.
Arteris said its broader multi-die portfolio also includes Magillem integration automation, which helps automate chiplet and multi-die integration, and Cycuity hardware security assurance for identifying vulnerabilities and verifying security requirements.
The company said the expanded portfolio provides semiconductor engineering teams with technologies covering data movement, system integration and security as they develop increasingly complex multi-die designs.
Arteris said the solutions are being used by customers transitioning existing architectures from single-die implementations to multi-die products, while the expanded portfolio is available to early access partners and strategic customers.
-- BERNAMA