CAMPBELL, Calif., Sept 17 (Bernama) -- Arteris, Inc. (Nasdaq: AIP), a leading provider of semiconductor technology for accelerating innovation in the AI era, today announced an expansion of its multi-die portfolio that helps semiconductor companies transition from monolithic system-on-chip (SoC) designs to chiplet-based architectures for AI, HPC and consumer electronics applications, without having to reinvent how data moves through the system.
Semiconductor companies are increasingly adopting multi-die architectures to address the demands of AI computing. They are now building systems that extend beyond the practical size limits of a single die, optimizing individual chiplets for different process technologies and dividing a system across multiple dies. This introduces a new challenge: communication that previously occurred within one SoC must now cross physical chip boundaries, while maintaining performance, efficiency, and predictable traffic behavior.