BARBING, Germany, Oct 1 (Bernama) -- ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally critical process steps. The first unit has been delivered to a leading semiconductor manufacturer for integration into its panel production line.
The machine is developed and manufactured at the company’s Advanced Packaging facility in Barbing, Germany. The facility combines ERS's 55 years of thermal management expertise with more than 30 years of in-house machine-building capability, following ERS's 2024 integration of a semiconductor specialist equipment engineering team.