KUALA LUMPUR, Sept 15 (Bernama) -- ZEISS, a technology enterprise operating in the fields of optics and optoelectronics, has introduced ZEISS VersaXRM 5 Insight, a hybrid 3D X-ray microscope designed to help researchers and engineers analyse samples faster.
Combining X-ray microscopy and microCT in a single platform, the system provides multi-scale imaging, guided workflows and automated artificial intelligence (AI)-enabled reconstruction for non-destructive 3D imaging.
In a statement, ZEISS Microscopy Head of the X-ray Microscopy Field of Business, Nicolas Gueninchault said the system enables users to work more efficiently while balancing throughput, resolution and ease of use, adding that it also helps protect valuable samples while providing 3D imaging capabilities.
ZEISS VersaXRM 5 Insight combines large field-of-view and high-resolution imaging in one system, allowing users to inspect larger samples, zoom into regions of interest and capture detailed 3D images without changing hardware configurations or interrupting workflows.
The system combines the throughput, flexibility and efficiency of microCT with the detailed imaging capabilities of laboratory-based X-ray microscopy, enabling a unified workflow for imaging large-scale structures and fine internal features while preserving sample integrity.
ZEISS VersaXRM 5 Insight features Resolution at a Distance (RaaD), which enables high-resolution imaging of small features and internal defects within larger samples. The technology reduces the need to cut, trim or refixture samples, helping users save time, reduce preparation errors and protect delicate or difficult-to-reproduce specimens.
The system also features ZEN navx, an intuitive software environment with intelligent guidance and sample-aware navigation that simplifies setup, supports sample-specific imaging decisions and helps protect samples and the system.
ZEISS VersaXRM 5 Insight supports applications across materials research, industrial inspection and life sciences, including failure analysis, internal defect detection, part quality inspection and 3D visualisation of biological structures across multiple scales.
The system also supports in-situ and 4D studies in materials research, as well as root-cause analysis of semiconductor and electronic packages and yield improvement in manufacturing and quality assurance applications.
-- BERNAMA